BAM is delighted to be hosting the 25th IAPRI Symposium from 16th-18th May 2011 in Berlin, Germany.

This is a particularly special symposium as 2011 marks the 40th anniversary of the establishment of IAPRI. The BAM Federal Institute for Materials Research and Testing also has a long history in the testing, approval and research of dangerous goods packaging and materials and has recently completed a large open-air test facility of 12km2, which is now in full operation. It can be used for large-scale tests according the BAM guideline “Safety in Technology and Chemistry”. There will be an opportunity to visit this facility and BAM’s laboratories during the Symposium.

This symposium offers the opportunity for leading minds in the packaging research community to present, discuss and exchange research findings and ideas and provides a fantastic platform for development and progress in the packaging field.
 

• Bio-Based and Packaging Materials
• Packaging for Food and Agriculture
• Distribution Packaging
• Medical, Cosmetic and Pharmaceutical Packaging
• Packaging Testing and Standards
• Packaging Management
• Packaging for Environment and Sustainability
• Active and Intelligent Packaging
• Packaging for Dangerous Goods
• Packaging Machinery and Systems
• Packaging Design and Development
• Packaging Education

IAPRI is pleased to announce that for the first time members will have the opportunity to present peer review papers at the Berlin Symposium 2011.

The symposium will offer two streams for presenters

• abstracts submission which if successful will result in authors preparing full papers for the symposium or alternatively they may be required to prepare posters.
• full paper submission for peer review. (Papers not accepted for peer review will automatically enter the non-peer review stream).

IAPRI is working with the Wiley’s Journal of Packaging Technology and Science in carrying out the peer review process and papers accepted will be presented at the symposium and published in the journal.

• Rafael Auras, Michigan State University, East Lansing, USA
• Laura Bix, Michigan State University, East Lansing, USA
• Ingo Bueren, IPI International Packaging Institute, Schaffhausen Switzerland
• Wanee Chinsirikul, MTEC, Pathumthani, Thailand
• Vanee Chonhenchob, Kasetsart University, Bangkok, Thailand
• Robb Clarke, Michigan State University, East Lansing, USA
• Mikael Gällstedt, INNVENTIA, Stockholm, Sweden
• Manuel García-Romeu Martínez, ITENE, Valencia, Spain
• Rafael Gavara, IATA-CSIC, Paterna, Spain
• Changfeng Ge, Rochester Institute of Technology, Rochester, USA
• Thomas Goedecke, BAM, Berlin, Germany
• Dan Goodwin, Rochester Institute of Technology, Rochester, USA
• Bruce Harte, Michigan State University, East Lansing, USA
• Mercedes Hortal, ITENE, Valencia, Spain
• Eero Hurme, VTT, Finland
• Kennert Johansson, INNVENTIA, Stockholm, Sweden
• Per-Åke Johansson, INNVENTIA, Stockholm, Sweden
• Robert Kimmel, Clemson University, Clemson, USA
• Bill Kipp, W.I. Kipp, Pacifica, USA
• Siv Lindberg, INNVENTIA, Stockholm, Sweden
• Xin-Guang Lu, Jinan University, Guangdong Zhuhai, China
• Christina Nerin, Universidad de Zaragoza, Spain
• Vincent Rouillard, Victoria University, Melbourne, Australia
• Michael Sek, Victoria University, Melbourne, Australia
• Susan Selke, Michigan State University, East Lansing, USA
• Paul Singh, Michigan State University, East Lansing, USA
• Jens Christian Sørensen, Ex-Director DTI, Frederiksberg, Denmark
• Diana Twede, Michigan State University, East Lansing, USA
• Zhi-Wei Wang, Jinan University, Guangdong Zhuhai, China
• Yves Wyser, Nestlé Research Center, Lausanne, Switzerland